Product Datasheet Search Results:
- 2176050-3
- Te Connectivity
- Heat Shrink Molded Boot
- 2-2176050-3
- Te Connectivity
- Res Thick Film 0402 0.43 Ohm 5% 0.125W(1/8W) ±300ppm/C Pad SMD Automotive T/R
Product Details Search Results:
Te.com/2-2176050-3
{"Failure Rate":"Not Required","Packaging ":"Tape and Reel","Military Standard":"Not Required","Current Sensing":"YES","Termination Style":"PAD","Temperature Coefficient":"'\u00b1300(ppm/\u00b0C)'","Temperature Range @ Derated Power":"70 TO 155","Package / Case":"0402","Case Style":"Epoxy","Type":"Thick Film","Product Height (mm)":"0.32(mm)","Construction":"Rectangular","Package Type":"SMD","Anti-Surge":"NO","Operating Temp Range":"-55C to 155C","Product Diameter (mm)":"Not Required(mm)","Case Size":"0402",...
1853 Bytes - 09:16:11, 24 November 2024
Documentation and Support
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File Name | File Size (MB) | Document | MOQ | Support |
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1SDX217605R1.pdf | 0.57 | 1 | Request |