IM Driver MPP-5 MPP-9 MPP-11 MPP-6 MPP-10 MPP-12 UIM1_RESET UIM1_CLK UIM1_DATA C249 SCD1U6D3V1KX-GP DY 2 MSM_UIM1_RESET MSM_UIM1_CLK MSM_UIM1_DATA MSM Thermistor QSD8K USB PHY Power C PM7540 GND MPP-17 MSM_THERM 2 R18 61K9R2F-GP VPH_PW R_3V3 VREG_USB 2 Q1 NTJD1155LT1G-GP 4 1 R21 2 PM7540_MPP7# 100KR1J-GP PM7540_MPP7 6 2 5 C52 SC1U10V2KX-1GP 2 1 R20 100KR1J-GP 2 DY E5 E6 E7 E8 E9 F5 F6 F7 F8 F9 G5 G6 G7 G8 G9 3 1 Note: Place close to MSM and SDRAM PA Thermistor GND GND GND GND GND GND GND GND GND GND B H5 H6 H7 H8 H9 J5 J6 J7 J8 J9 M-7540-0-137-GP-U 1 PA_THERM 2 R22 61K9R2F-GP R23 NTC-68K-1-GP A Wistron Corporation 2 A GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 1 VREG_HKADC 4 OF 4 U1D R19 NTC-68K-1-GP 1 B 1 1 VREG_HKADC 21F, 88, Sec.1, Hsin Tai W u Rd., Hsichih, Taipei Hsien 221, Taiwan, R.O.C. Note: Place close to PA Title PM7540 (Audio, Power, MGT) www.laptop-schematics.com 5 4 3 2 Size A3 Document Number Rev Date: Tuesday, June 30, 2009 T-note SC Sheet 1 5 of 34 5 4 3 2 ADSP Po

IM Driver MPP-5 MPP-9 MPP-11 MPP-6 MPP-10 MPP-12 UIM1_RESET UIM1_CLK UIM1_DATA C249 SCD1U6D3V1KX-GP DY 2 MSM_UIM1_RESET MSM_UIM1_CLK MSM_UIM1_DATA MSM Thermistor QSD8K USB PHY Power C PM7540 GND MPP-17 MSM_THERM 2 R18 61K9R2F-GP VPH_PW R_3V3 VREG_USB 2 Q1 NTJD1155LT1G-GP 4 1 R21 2 PM7540_MPP7# 100KR1J-GP PM7540_MPP7 6 2 5 C52 SC1U10V2KX-1GP 2 1 R20 100KR1J-GP 2 DY E5 E6 E7 E8 E9 F5 F6 F7 F8 F9 G5 G6 G7 G8 G9 3 1 Note: Place close to MSM and SDRAM PA Thermistor GND GND GND GND GND GND GND GND GND GND B H5 H6 H7 H8 H9 J5 J6 J7 J8 J9 M-7540-0-137-GP-U 1 PA_THERM 2 R22 61K9R2F-GP R23 NTC-68K-1-GP A Wistron Corporation 2 A GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 1 VREG_HKADC 4 OF 4 U1D R19 NTC-68K-1-GP 1 B 1 1 VREG_HKADC 21F, 88, Sec.1, Hsin Tai W u Rd., Hsichih, Taipei Hsien 221, Taiwan, R.O.C. Note: Place close to PA Title PM7540 (Audio, Power, MGT) 5 4 3 2 Size A3 Document Number Rev Date: Tuesday, June 30, 2009 T-note SC Sheet 1 5 of 34 5 4 3 2 ADSP Power Digital Core Power TPS

fect device reliability. 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). (c) Semiconductor Components Industries, LLC, 2012 November, 2012 - Rev. 5 1 G1 5 S2 4 2 3 D2 D2 ORDERING INFORMATION Device NTJD1155LT1G Package Shipping SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Characteristic Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS VDS1 = 0 V, VGS1 = 8.0 V Q1 Diode Forward On-Voltage VSD IS = -0.4 A, VGS1 = 0 V mA 100 nA -1.1 V 1.5 8.0 V -0.8 ON CHARACTERISTICS ON/OFF Voltage

PAK 600 4800 57 2.2 TO-252 600 3600 61 2.6 IPAK 600 2000 83 4.1 TO-220F-3FS 1500 150000 2 0.1 TO-220F-3FS 1500 10500 2 2.5 TO-3P-3L 1500 10500 2.5 2.5 TO-3P-3L 1500 10500 3 2.5 TO-3PF 1700 10500 55 3 Package P-Channel MOUSER STOCK NO. Negative RDS(on) 863-NTJD1155LT1G 863-NTR0202PLT1G 863-NTR1P02T1G 863-NTS4101PT1G 863-NTGS3443T1G 863-NTGS3441T1G 863-NTMS5P02R2G 863-NTHS4101PT1G 863-NTS4173PT1G 863-NTR4502PT1G 863-NTR4171PT1G 863-NTGS4111PT1G 863-NTMS4177PR2G 863-NTGS5120PT1G 863-NTF2955T1G 863-NTD2955T4G 863-NTP2955G 863-NTD20P06LT4G 863-NTB5605PT4G 863-NTB25P06T4G Positive RDS(on) 863-MCH6664-TL-W 863-BSS84LT1G ON Semiconductor Part No. Package V(BR)DSS (Max.) (V) NTJD1155LT1G NTR0202PLT1G NTR1P02T1G NTS4101PT1G NTGS3443T1G NTGS3441T1G NTMS5P02R2G NTHS4101PT1G NTS4173PT1G NTR4502PT1G NTR4171PT1G NTGS4111PT1G NTMS4177PR2G NTGS5120PT1G NTF2955T1G NTD2955T4G NTP2955G NTD20P06LT4G NTB5605PT4G NTB25P06T4G SOT-363 SOT-23 SOT-23 SC-70 TSOP-6 TSOP-6 SOIC-8 ChipFET SC-70 SOT-23 SOT-23 TSOP-

0-32T3 SZ2826RL SZBZX84C36LT3 SZBZX84C36LT3 SZBZX84C7V5LT3 SZMMBZ5225BLT1 SZMMBZ5234BLT3 SZMMBZ5237BLT1 UESD12ST5G UESD3.3ST5G Issue Date: 04 Apr 2008 Replacement Device NBSG86ABAHTBG NBSG86ABAHTBG none none NTD4860N-1G TRUE TRUE NTJD4401NT1G NTJS3157NT1G NTJD1155LT1G none none none None NTMFS4839NHT1G NTMFS4839NHT3G none NTR4503NT1G NTZD3152PT1G NTZD3152PT1H NTZS3151PT1G NTZS3151PT1H none none none none MMBZ5240BLT1G MMBZ5244BLT1G SZMMBZ5245BLT1G none NCP1203P60G UC3843BD1R2G none none none 1.5KE56ARL4G P6SMB30AT3G SA30ARLG BZX84C36LT3G BZX84C36LT3G BZX84C7V5LT1G MMBZ5225BLT1G MMBZ5234BLT1G MMBZ5237BLT1G ESD9X12ST5G ESD9X3.3ST5G Rev.08-24-05 Replacement Device Supplier ON Semiconductor ON Semiconductor None Available None Available ON Semiconductor NTD4860N-35G NTD4860NT4G ON Semiconductor ON Semiconductor ON Semiconductor None Available None Available None Available ON Semiconductor ON Semiconductor ON Semiconductor None Available ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconduc

reliability may be affected. 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). (c) Semiconductor Components Industries, LLC, 2012 May, 2019 - Rev. 6 1 G1 5 S2 4 2 3 D2 D2 ORDERING INFORMATION Device NTJD1155LT1G, NTJD1155LT2G Package Shipping SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Characteristic Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS VDS1 = 0 V, VGS1 = 8.0 V Q1 Diode Forward On-Voltage VSD IS = -0.4 A, VGS1 = 0 V mA 100 nA -1.1 V 1.5 8.0 V -0.8 ON CHARACTERISTICS

s TB M G G TB = Device Code M = Date Code 1 G = Pb-Free Package (Note: Microdot may be in either location) 0.9 PD MARKING DIAGRAM SC-88 (SOT-363) CASE 419B STYLE 30 MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Input Voltage (VDSS, P-Ch) Q1 5 1 Device NTJD1155LT1G, NTJD1155LT2G Package Shipping SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). www.onsemi.com 2 NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Characteristic Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS

T1G NTJD4105CT1G NTHC5513T1G NTHD3102CT1G Price Each 1-24 0.82 0.23 0.47 0.31 0.51 0.17 0.63 0.29 0.79 0.42 (161780) N CHANNEL PLUS SCHOTTKY BARRIER DIODE 30 NTLUF4189NZTAG 1.5 145 800 (148733) P CHANNEL SMALL SIGNAL MOSFETS SINGLE P CHANNEL Mfg. Part No. NTJD1155LT1G NTS2101PT1G NTGD1100LT1G NTR2101PT1G NTJS3151PT1G NTR0202PLT1G NTA4151PT1G NTE4151PT1G NTK3139PT1G V(BR) DSS Min (V) 8 8 8 8 12 20 20 20 20 ID Max (A) 1.3 1.4 3.3 3.7 3.3 0.4 0.76 0.76 0.78 rDS(on) Max (m) 175 100 55 52 60 800 360 360 480 PD Max (W) 400 290 830 960 625 225 301 313 550 Package 6-SOT-363 3-SC-70 6-TSOP SOT-23 6-SOT-363 3-SOT-23 3-SC-75 3-SC-89 3-SOT-723 Tape Cut Price Each Stock No. 1-24 10N9720 0.45 0.19 10N9726 0.49 0.35 10N9574 0.65 --45J2174 0.46 0.16 10N9723 0.47 0.34 10N9585 0.36 0.17 0.29 10N9708 0.40 10N9572 0.68 0.13 27M2737 0.44 0.12 TMOS POWER MOSFETs Mfg. Part No. MGSF1N02LT1G NTMD6N02R2G MGSF1N03LT1G MTD6N15T4G MTD6N20ET4G V(BR)DSS Min. (V) 20 20 30 150 200 (74511) 298 STIBOINFO((NEWARK_MAIN_C124_298)) C-

s TB M G G TB = Device Code M = Date Code 1 G = Pb-Free Package (Note: Microdot may be in either location) 0.9 PD MARKING DIAGRAM SC-88 (SOT-363) CASE 419B STYLE 30 MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Input Voltage (VDSS, P-Ch) Q1 5 1 Device NTJD1155LT1G, NTJD1155LT2G Package Shipping SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). www.onsemi.com 2 NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Characteristic Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS

fect device reliability. 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). (c) Semiconductor Components Industries, LLC, 2012 November, 2012 - Rev. 5 1 G1 5 S2 4 2 3 D2 D2 ORDERING INFORMATION Device NTJD1155LT1G Package Shipping SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Characteristic Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS VDS1 = 0 V, VGS1 = 8.0 V Q1 Diode Forward On-Voltage VSD IS = -0.4 A, VGS1 = 0 V mA 100 nA -1.1 V 1.5 8.0 V -0.8 ON CHARACTERISTICS ON/OFF Voltage

Date Code 1 PIN ASSIGNMENT D1/G2 6 Rating Symbol Max Unit Junction-to-Ambient - Steady State (Note 1) RJA 320 C/W Junction-to-Foot - Steady State (Note 1) RJF 220 G1 5 1 S1 S2 4 2 3 D2 D2 ORDERING INFORMATION Device NTJD1155LT1 THERMAL RESISTANCE RATINGS NTJD1155LT1G Package Shipping SC-88 3000/Tape & Reel SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). October, 2004 - Rev. 0 1 0.20 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components I

face-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). April, 2006 - Rev. 3 1 0.20 THERMAL CHARACTERISTICS (c) Semiconductor Components Industries, LLC, 2006 MARKING DIAGRAM SC-88 (SOT-363) CASE 419B STYLE 30 1 NTJD1155LT1G Package Shipping SC-88 3000/Tape & Reel SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Characteristic Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS VDS1 = 0 V, VGS1 = 8.0 V Q1 Diode Forward On-Voltage VSD IS = -0.4 A, VGS1 = 0 V mA 100 nA -1.1 V 1.5 8.0 V -0.8 ON CHARACT

e reliability. 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). (c) Semiconductor Components Industries, LLC, 2007 1 0.20 THERMAL CHARACTERISTICS MARKING DIAGRAM SC-88 (SOT-363) CASE 419B STYLE 30 1 NTJD1155LT1G Package Shipping SC-88 3000/Tape & Reel SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTJD1155L/D NTJD1155L ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Symbol Test Condition Min Q2 Drain-to-Source Breakdown Voltage VIN VGS2 = 0 V, ID2 = 250 mA -8.0 Forward Leakage Current IFL Characteristic Typ Max Unit OFF CHARACTERISTICS VGS1 = 0 V, VDS2 = -8.0 V V TJ = 25C 1.0 TJ = 125C 10 Q1 Gate-to-Source Leakage Current IGSS VDS1 = 0 V, VGS1 = 8.0 V Q1 Diode Forward On-Voltage VSD IS = -0.4 A, VGS1 = 0 V mA 100 nA -1.1 V 1.5 8.0 V -0.8 ON CHARACT

Date Code 1 PIN ASSIGNMENT D1/G2 6 Rating Symbol Max Unit Junction-to-Ambient - Steady State (Note 1) RJA 320 C/W Junction-to-Foot - Steady State (Note 1) RJF 220 G1 5 1 S1 S2 4 2 3 D2 D2 ORDERING INFORMATION Device NTJD1155LT1 THERMAL RESISTANCE RATINGS NTJD1155LT1G Package Shipping SC-88 3000/Tape & Reel SC-88 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1. Surface-mounted on FR4 board using 1 inch sq pad size (Cu area = 1.127 in sq [1 oz] including traces). February, 2005 - Rev. 1 1 0.20 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components