IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40C -40 C to 125C 950 V 2.5 mV TLV2264AID TLV2264ID -- -- -- -- TLV2264AIN TLV2264IN TLV2264AIPWLE -- -- -- -40 C to -40C 125C 950 V 2.5 mV TLV2264AQD TLV2264QD -- -- -- -- -- -- -- -- -- -- -55C to 125C
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40C -40 C to 125C 950 V 2.5 mV TLV2264AID TLV2264ID -- -- -- -- TLV2264AIN TLV2264IN TLV2264AIPWLE -- -- -- -40 C to -40C 125C 950 V 2.5 mV TLV2264AQD TLV2264QD -- -- -- -- -- -- -- -- -- -- -55C to 125C
IOmax AT 25C TA SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0C to 70C 2.5 mV TLV2262CD -- -- TLV2262CP TLV2262CPWLE -- -40C to 125C 950 V 2.5 mV TLV2262AID TLV2262ID -- -- -- -- TLV2262AIP TLV2262IP TLV2262AIPWLE -- -- -- -40C to 125C 950 V 2.5 mV TLV2262AQD TLV2262QD -- -- -- -- -- -- -- -- -- -- -55C to 125C 950 V 2.5 mV -- -- TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG -- -- -- -- TLV2262AMU TLV2262MU The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). The PW package is available only left-end taped and reeled. Chips are tested at 25C. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) -40 C to -40C 125C 950 V 2.5 mV TLV2264AID TLV2264I