UMMARY Number of Pads Metal Wiring 753,768 496 3LM CG51654 647,948 456 3LM CG51484 477,632 400 3LM Clock net for optimized on-chip clock skew control CG51364 363,084 352 3LM Advanced packaging options include QFP, PGA, BGA, and MCM CG51284 277,380 304 3LM CG51214 214,760 272 3LM High drive capability: 2, 4, 8, 12, or 24mA CG51164 160,140 240 3LM Supports all major third party EDA tools including: Cadence, Mentor, Synopsys CG51114 113,520 208 3LM CG51343 34,272 120 3LM Supports 3.3V and 5.0V I/O RAM compiler supports Single/Dual/Triple port RAM Supports JTAG boundary scan, full and partial scan Phase Locked Loop for interchip clock skew control Copyright 1994 by FUJITSU LIMITED Device Name Available Gates CG51754 CG51/CE51 SERIES DC CHARACTERISTICS Measuring conditions: VDD = 3.3V + 0.3V,VSS = 0V, Tj = -0 to 100C Parameter Supply current2 High-level High level input voltage3 Low-level Low level input voltage3 Symbol IDDS VIH VIL Test Conditions Standby mode1 CG51343 to CG51214 -1.0 -
tial scan . . CG51484 477,632 400 3LM e Phase Locked Loop for interchip clock skew control _ : CG51364 363,084 352 3LM Clock net for optimized on-chip clock skew control CG51284 277,380 304 3LM e Advanced packaging options include QFP, PGA, BGA, , and MCM CG51214 214,760 272 3LM e High drive capability: 2, 4, 8, 12, or 24mA CG51164 160,140 240 3LM Supports all major third party EDA tools including: CG51114 113,520 208 3LM Cadence, Mentor, Synopsys CG51343 34,272 120 3LM Copyright 1994 by FUJITSU LIMITEDCG51/CE51 SERIES DC CHARACTERISTICS Measuring conditions: Vpp = 3.3V + 0.3V,Vsg = OV, Tj = 0 to 100C a Requirements | Parameter Symbol Test Conditions 7 Unit Min. Typ. Max. CG51343 to CG51214 1.0 - 1.0 Supply current? Ipps Standby mode! Cee taed to -2.0 - 2.0 mA CG51654 to CG51754 3.0 - 3.0 CMOS Normal cell Vpp X 0.7 - Vpp High-level ah el input voltage Vin level Schmitt trigger cell Vpp X 0.8 - Vpp V TTL level Normal cell 2.2 - Vpp CMOS Normal cell Vss - Vpp X 0.2 Low-level ah el inpu
0.6 Ball size () 0.75 0.75 0.75 0.75 0.75 PKG Weight ~2.8g TBD ~8.0g 11.2g ~11.5g Package Selector Guide for CG/CE51 0.5 micron ASIC Products CG51 Device CE51 Device No. of Pads CG51343 CE51343 120 CG51114 CE51114 208 BGA-256 (Type-B) CG51164 CE51164 240 CG51214 CE51214 272 CG51284 CE51284 304 CG51364 CE51364 352 CG51484 CE51484 400 BGA-352 (Type-B) BGA-352 (Type-C) BGA-416 (Type-C) CG51654 CE51654 456 CG51754 CE51754 496 BGA-576 (Type-C) Package Selector Guide for CG/CE46 0.65 micron ASIC Products CE46 Device No. of Pads BGA-256 (Type-B) BGA-352 (Type-B) CE46533 208 CE46713 240 CE46833 256 CE46903 272 CE46104 288 CE46114 304 CE46134 336 CG46154 352 CE46194 400 3 BALL GRID ARRAY (BGA) PACKAGES ASIC TECHNOLOGY BRIEF PACKAGE DIMENSIONS BGA352 (Type-C) 35.00 SQ 31.75 Index C1.0 1.27 1.625 1.625 14.50 SQ (RESIN) 0.635 3.10 NOM. 2.50 0.50 0.60 0.10 0.25 MIN. 22.00 SQ. 1.27 31.75 0.635 4-R1.00 4-R1.00 352 o0.75 0.15 Cu heatsink BGA416 (Type-C) 40.00 SQ 36.83 Index C1.0 16.50 SQ (RESIN) 1.27 0.635 1.58