K4C89093AF-GCF6
32M X 9 DDR DRAM, 0.5 ns, PBGA60

From Samsung Semiconductor Division

StatusACTIVE
Access ModeFOUR BANK PAGE BURST
Access Time-Max (tRAC)0.5000 ns
Memory Density3.02E8 deg
Memory IC TypeDDR DRAM
Memory Width9
Mfr Package Description1 MM PITCH, FBGA-60
Number of Functions1
Number of Ports1
Number of Terminals60
Number of Words3.36E7 words
Number of Words Code32M
Operating ModeSYNCHRONOUS
Operating Temperature-Max70 Cel
Operating Temperature-Min0.0 Cel
Organization32M X 9
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleGRID ARRAY
Supply Voltage-Max (Vsup)2.62 V
Supply Voltage-Min (Vsup)2.38 V
Supply Voltage-Nom (Vsup)2.5 V
Surface MountYes
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishTIN LEAD
Terminal FormBALL
Terminal PositionBOTTOM

External links