CL03X104KQ3NNNC Cap Ceramic 0.1uF 6.3V X6S 10% Pad SMD 0201 105C T/R
From SAMSUNG
| Capacitance | 100000(pF) |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | Not Required |
| Lead Diameter (nom) | Not Required(mm) |
| Microwave Application | NO |
| Mounting Style | Surface Mount |
| Number of Terminals | 2 |
| Operating Temp Range | -55C to 105C |
| Package / Case | 0201 |
| Packaging | Tape and Reel |
| Product Depth (mm) | 0.3(mm) |
| Product Diameter (mm) | Not Required(mm) |
| Product Height (mm) | 0.3(mm) |
| Product Length (mm) | 0.6(mm) |
| Rad Hardened | No |
| Seated Plane Height | Not Required(mm) |
| Technology | STANDARD |
| Temp Coeff (Dielectric) | X6S |
| Termination Style | PAD |
| Tolerance (+ or -) | 10% |
| Voltage | 6.3VDC |
| Wire Form | Not Required |
