WED9LC6816V1610BI SPECIALTY MEMORY CIRCUIT, PBGA153
From Microsemi Corp.
Status | ACTIVE |
Memory Density | 8.39E6 deg |
Memory IC Type | MEMORY CIRCUIT |
Memory Width | 32 |
Mfr Package Description | 14 X 22 MM, MO-163, BGA-153 |
Number of Functions | 1 |
Number of Terminals | 153 |
Number of Words | 262144 words |
Number of Words Code | 256K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 256K X 32 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY |
Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 3.14 V |
Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount | Yes |
Temperature Grade | INDUSTRIAL |
Terminal Finish | NOT SPECIFIED |
Terminal Form | BALL |
Terminal Pitch | 1.27 mm |
Terminal Position | BOTTOM |