MX69F164C3BTXBI-90 SPECIALTY MEMORY CIRCUIT, PBGA66
From Macronix International Co., Ltd.
Status | DISCONTINUED |
Memory Density | 1.68E7 deg |
Memory IC Type | MEMORY CIRCUIT |
Memory Width | 16 |
Mfr Package Description | 11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66 |
Number of Functions | 1 |
Number of Terminals | 66 |
Number of Words | 1.05E6 words |
Number of Words Code | 1M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 1M X 16 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 0.8000 mm |
Terminal Position | BOTTOM |