SLE5542M3 256 X 8 EEPROM 5V, DMA
From Infineon Technologies AG
| Status | ACTIVE |
| Memory Density | 2048 deg |
| Memory IC Type | EEPROM 5V |
| Memory Width | 8 |
| Mfr Package Description | WIRE BONDED MODULE M3 |
| Number of Functions | 1 |
| Number of Words | 256 words |
| Number of Words Code | 256 |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 80 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 256 X 8 |
| Package Body Material | UNSPECIFIED |
| Package Shape | RECTANGULAR |
| Package Style | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | SERIAL |
| Supply Voltage-Max (Vsup) | 5.5 V |
| Supply Voltage-Min (Vsup) | 4.5 V |
| Supply Voltage-Nom (Vsup) | 5 V |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | NO LEAD |
| Terminal Position | DUAL |
| Write Cycle Time-Max (tWC) | 5 ms |
