IDT72T3675L5BBI
8K X 36 OTHER FIFO, 3.6 ns, PBGA208

From Integrated Device Technology

StatusACTIVE
Access Time-Max (tACC)3.6 ns
Cycle Time5 ns
Memory Density294912 deg
Memory IC TypeOTHER FIFO
Memory Width36
Mfr Package Description17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208
Number of Functions1
Number of Terminals208
Number of Words8192 words
Number of Words Code8K
Operating ModeSYNCHRONOUS
Operating Temperature-Max85 Cel
Operating Temperature-Min-40 Cel
Organization8K X 36
Output EnableYes
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY
Supply Voltage-Max (Vsup)2.62 V
Supply Voltage-Min (Vsup)2.38 V
Supply Voltage-Nom (Vsup)2.5 V
Surface MountYes
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN LEAD
Terminal FormBALL
Terminal Pitch1 mm
Terminal PositionBOTTOM

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