72T3675L6-7BBG
8K X 36 OTHER FIFO, 3.8 ns, PBGA208

From Integrated Device Technology

StatusACTIVE
Access Time-Max (tACC)3.8 ns
Cycle Time6.7 ns
EU RoHS CompliantYes
Lead FreeYes
Memory Density294912 deg
Memory IC TypeOTHER FIFO
Memory Width36
Mfr Package Description17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208
Number of Functions1
Number of Terminals208
Number of Words8192 words
Number of Words Code8K
Operating ModeSYNCHRONOUS
Operating Temperature-Max70 Cel
Operating Temperature-Min0.0 Cel
Organization8K X 36
Output EnableYes
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY
Supply Voltage-Max (Vsup)2.62 V
Supply Voltage-Min (Vsup)2.38 V
Supply Voltage-Nom (Vsup)2.5 V
Surface MountYes
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch1 mm
Terminal PositionBOTTOM

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