72T3675L5BBI 8K X 36 OTHER FIFO, 3.6 ns, PBGA208
From Integrated Device Technology
| Status | DISCONTINUED |
| Access Time-Max (tACC) | 3.6 ns |
| Cycle Time | 5 ns |
| Memory Density | 294912 deg |
| Memory IC Type | OTHER FIFO |
| Memory Width | 36 |
| Mfr Package Description | 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| Number of Functions | 1 |
| Number of Terminals | 208 |
| Number of Words | 8192 words |
| Number of Words Code | 8K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 8K X 36 |
| Output Enable | Yes |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Supply Voltage-Max (Vsup) | 2.62 V |
| Supply Voltage-Min (Vsup) | 2.38 V |
| Supply Voltage-Nom (Vsup) | 2.5 V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | BALL |
| Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
