HY27SF081G2A-FPIS 128M X 8 FLASH 1.8V PROM, 30 ns, PBGA63
From SK Hynix
Status | DISCONTINUED |
Access Time-Max (tACC) | 30 ns |
China RoHS Compliant | Yes |
EU RoHS Compliant | Yes |
Lead Free | Yes |
Memory Density | 1.02E9 deg |
Memory IC Type | FLASH 1.8V PROM |
Memory Width | 8 |
Mfr Package Description | 9 X 11 MM, 1 MM HEIGHT, LEAD FREE, FPBGA-63 |
Number of Functions | 1 |
Number of Terminals | 63 |
Number of Words | 1.28E8 words |
Number of Words Code | 128M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 128M X 8 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 1.95 V |
Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | Yes |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL |
Terminal Pitch | 0.8000 mm |
Terminal Position | BOTTOM |