DIP316-011BLF CONN IC DIP SOCKET 16POS GOLD
From FCI
Category | Connectors, Interconnects |
Contact Finish - Mating | Gold |
Contact Finish - Post | Tin |
Contact Finish Thickness - Mating | 10µin (0.25µm) |
Contact Finish Thickness - Post | 200µin (5.08µm) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Contact Resistance | - |
Current Rating | - |
Datasheets | DIP306-648 B Series |
Family | Sockets for ICs, Transistors |
Features | Open Frame |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Material Flammability Rating | UL94 V-0 |
Mounting Type | Through Hole |
Number of Positions or Pins (Grid) | 16 (2 x 8) |
Operating Temperature | - |
PCN Obsolescence/ EOL | Multiple Devices/Sockets 04/Dec/2008 |
Packaging | Tube |
Pitch - Mating | 0.100" (2.54mm) |
Pitch - Post | 0.100" (2.54mm) |
Series | - |
Standard Package | 2,700 |
Termination | Solder |
Termination Post Length | 0.125" (3.18mm) |
Type | DIP, 0.3" (7.62mm) Row Spacing |