DIP316-011BLF
CONN IC DIP SOCKET 16POS GOLD

From FCI

CategoryConnectors, Interconnects
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
Contact Resistance-
Current Rating-
DatasheetsDIP306-648 B Series
FamilySockets for ICs, Transistors
FeaturesOpen Frame
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)16 (2 x 8)
Operating Temperature-
PCN Obsolescence/ EOLMultiple Devices/Sockets 04/Dec/2008
PackagingTube
Pitch - Mating0.100" (2.54mm)
Pitch - Post0.100" (2.54mm)
Series-
Standard Package2,700
TerminationSolder
Termination Post Length0.125" (3.18mm)
TypeDIP, 0.3" (7.62mm) Row Spacing

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