CYF2072V18L-100BGXI MULTI DEVICE FIFO MODULE, PBGA209
From Cypress Semiconductor Corp.
| Status | ACTIVE |
| Memory IC Type | MULTI DEVICE FIFO MODULE |
| Mfr Package Description | 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209 |
| Number of Terminals | 209 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Surface Mount | Yes |
| Terminal Form | BALL |
| Terminal Position | BOTTOM |
