Q3-0.005-00-22 THERMAL PAD DO-4 LARGE Q3
From Bergquist
| Adhesive | - |
| Backing, Carrier | Fiberglass |
| Category | Fans, Thermal Management |
| Color | Black |
| Datasheets | Q-Pad 3 Sil-Pad Selection Guide |
| Family | Thermal - Pads, Sheets |
| MSDS Material Safety Datasheet | Q-Pad 3 MSDS |
| Material | Elastomer |
| Other Names | BER126 Q3-22 |
| Outline | 15.87mm x 5.08mm |
| RoHS Information | Q-PAd 3 Material Report |
| Series | Q-Pad® 3 |
| Shape | Round |
| Standard Package | 100 |
| Thermal Conductivity | 2.0 W/m-K |
| Thermal Resistivity | 0.35°C/W |
| Thickness | 0.0050" (0.127mm) |
| Usage | DO-4 |
