HF115AC-0.0055-AC-90 THERM PAD TO-218 W/ADH HI-FLOW
From Bergquist
| Adhesive | Adhesive - One Side |
| Backing, Carrier | Fiberglass |
| Catalog Drawings | TO-218,TO-220_90 |
| Category | Fans, Thermal Management |
| Color | Gray |
| Datasheets | Hi-Flow 115-AC |
| Family | Thermal - Pads, Sheets |
| Material | Phase Change Compound |
| Online Catalog | Hi-Flow® 115-AC Series |
| Other Names | BER169 HF115AC-90 HF115AC00055AC90 HF115TAAC-90 |
| Other Related Documents | Sil-Pad Metric Configurations |
| Outline | 21.84mm x 18.79mm |
| Product Photos | HF115AC-0.0055-AC-90 |
| RoHS Information | Hi-Flow 115-AC Material Report |
| Series | Hi-Flow® 115-AC |
| Shape | Rectangle |
| Standard Package | 100 |
| Thermal Conductivity | 0.8 W/m-K |
| Thermal Resistivity | 0.35°C/W |
| Thickness | 0.0055" (0.140mm) |
| Usage | TO-218, TO-220, TO-247 |
