GP2000S40-0.040-02-4/4
THERMALLY CONDUCTIVE GAP FILING MATERIAL

From BERGQUIST

Breakdown Voltage Vbr:5 kV
Dielectric Strength:-
Insulator Body Material:Fibreglass
SVHC:To Be Advised
Thermal Conductivity:2 W/m.K
Thermal Impedance:0.97 °C/W
Thickness:1.016 mm
Volume Resistivity:10 ohm-m

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