100-008-001
CONN IC DIP SOCKET 8POS GOLD

From 3M

CategoryConnectors, Interconnects
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating8µin (0.20µm)
Contact Finish Thickness - PostFlash
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
Contact Resistance-
Current Rating1A
Datasheets1x0-0xx-05y
FamilySockets for ICs, Transistors
FeaturesClosed Frame, Seal Tape
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)8 (2 x 4)
Operating Temperature-65°C ~ 125°C
Other Names05111165333 JE150135893
PackagingBulk
Pitch - Mating0.100" (2.54mm)
Pitch - Post0.100" (2.54mm)
Series100
Standard Package200
TerminationSolder
Termination Post Length0.126" (3.20mm)
TypeDIP, 0.3" (7.62mm) Row Spacing

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